| Preface |
xvii |
| Executive
Summary |
xix |
|
|
| Chapter
1. Processor Technology |
1 |
Processor Basics |
1 |
CPU
Microarchitecture |
4 |
Main
Memory |
11 |
I/O
and Network Interfaces |
14 |
| Chapter
2. Embedded Applications |
19 |
| Networking
and Communications Equipment |
19 |
| Control
Plane vs. Data Plane |
19 |
| Control-Plane
Processing |
21 |
| Data-Plane
Applications |
22 |
| Services
Cards |
22 |
| Networked
Storage and RAID Controllers |
23 |
| Security |
23 |
| Broadband Infrastructure |
24 |
| Wireless Base Stations |
25 |
| Consumer
Electronics |
26 |
| Set-Top Boxes |
26 |
| Home Networking |
27 |
| High-Speed
Printers |
28 |
| PC-Like
Applications |
28 |
| Industrial
Control, Medical, Military |
30 |
| Chapter
3. Standard Instruction Sets |
31 |
| Architecture Comparison |
31 |
| Technology |
31 |
| Market Position |
32 |
| x86
Instruction Set |
33 |
| Background |
33 |
| Initial
Instruction Set |
34 |
| Recent
Extensions |
34 |
| MIPS
Instruction Set |
35 |
| Background |
35 |
| Initial
Instruction Set |
36 |
| Recent
Extensions |
37 |
| PowerPC
Instruction Set |
38 |
| Background |
38 |
| Initial
Instruction Set |
39 |
| ARM
Instruction Set |
41 |
| Background |
41 |
| Instruction Set |
42 |
| Recent
Extensions |
42 |
| Chapter
4. High-Speed
Processors |
45 |
| What
Is a High-Speed Embedded Processor? |
45 |
| What is Not a High-Speed Embedded Processor |
46 |
| Standalone vs. Integrated Processors |
46 |
| Encryption Engines |
48 |
| Benchmarks |
48 |
| CPU Benchmarks
|
48 |
| Security Performance |
49 |
| Chapter
5. Technology and Market Trends |
51 |
| Technology
Trends |
51 |
| Multicore |
51 |
| Integration Trends |
52 |
| Embedded
vs. Communications Processors |
53 |
| Market
Overview |
53 |
| Market
Size |
53 |
| Market
Share |
55 |
| Market
Forecast |
56 |
| Chapter
6. AMCC |
59 |
| Company
Background |
59 |
| Key
Features and Performance |
60 |
| Internal
Architecture |
63 |
| System
Design |
65 |
| Development
Tools |
67 |
| Product
Roadmap |
67 |
| Conclusions |
68 |
| Chapter
7. Cavium |
71 |
| Company
Background |
71 |
| Key
Features and Performance |
72 |
| Internal
Architecture |
75 |
| System
Design |
77 |
| Development
Tools |
79 |
| Product
Roadmap |
79 |
| Conclusions |
80 |
| Chapter
8. Freescale |
83 |
| Company
Background |
83 |
| Key
Features and Performance |
84 |
| MPC83xx
(PowerQuicc II Pro) |
85 |
| MPC85xx
(PowerQuicc III) |
86 |
| MPC86xx |
88 |
| Internal
Architecture |
90 |
| e300
CPU |
90 |
| e600
CPU |
91 |
| e500
CPU |
92 |
| Security
Engine |
93 |
| System
Design |
93 |
| Development
Tools |
96 |
| Product
Roadmap |
96 |
| Conclusions |
97 |
| Chapter
9. Intel |
99 |
| Company
Background |
99 |
| Key
Features and Performance |
100 |
| Core
Duo Products |
100 |
| Tolapai Products |
102 |
| Atom Products |
103 |
| Internal
Architecture |
105 |
| CPU
Microarchitecture |
105 |
| Tolapai
Architecture |
109 |
| System
Design |
110 |
| Standalone
Processors |
110 |
| Atom-Based Systems |
111 |
| Tolapai-Based Systems |
112 |
| Development
Tools |
113 |
| Product
Roadmap |
114 |
| Conclusions |
115 |
| Chapter
10. PMC-Sierra |
119 |
| Company
Background |
119 |
| Key
Features and Performance |
120 |
| Internal
Architecture |
121 |
| System
Design |
123 |
| Development
Tools |
124 |
| Product
Roadmap |
125 |
| Conclusions |
125 |
| Chapter
11. RMI |
127 |
| Company
Background |
127 |
| Key
Features and Performance |
128 |
| XLR
Processors |
128 |
| XLS
Processors |
129 |
| Internal Architecture |
130 |
| System
Design |
131 |
| Development
Tools |
133 |
| Product
Roadmap |
133 |
| Conclusions |
134 |
| Chapter
12. Other Vendors |
135 |
| AMD |
135 |
| Company
Background |
135 |
| Key
Features and Performance |
135 |
| Conclusions |
138 |
| Broadcom |
138 |
| Company
Background |
138 |
| Key
Features and Performance |
139 |
| Conclusions |
140 |
| IBM |
141 |
| Company
Background |
141 |
| Key
Features and Performance |
142 |
| Conclusions |
143 |
| Marvell |
143 |
| Company
Background |
143 |
| Key
Features and Performance |
144 |
| Conclusions |
146 |
| Montalvo |
147 |
| P.A.
Semi |
147 |
| Via |
148 |
| Company
Background |
148 |
| Key
Features and Performance |
148 |
| Conclusions |
150 |
| Chapter
13. Processor Comparisons |
151 |
| Low-Cost
Processors |
152 |
| Performance |
152 |
| Interfaces |
153 |
| Conclusions |
155 |
| Midrange
Processors |
156 |
| Performance |
156 |
| Interfaces |
157 |
| Conclusions |
159 |
High-End
Processors |
160 |
| High-End
Processors |
160 |
| Ultra-High-End
Processors |
163 |
| Conclusions |
165 |
Multicore
Processors |
166 |
| Performance |
166 |
| Interfaces |
168 |
| Conclusions |
168 |
| Chapter
14. Conclusions |
169 |
| Market
Trends |
169 |
| Consumer Opportunities |
169 |
| Networking Data Plane |
170 |
| Kiosks |
170 |
| Likely
Winners |
171 |
| Closing Thoughts |
173 |
| |
|
| Appendix:
Further Reading |
175 |
| Index |
177 |
| |
| List
of Figures |
| List
of Tables |