A Guide to
High-Speed Interconnects,
Fourth Edition
  

TO BE PUBLISHED MAY 2008

Authors:   Jag Bolaria and Bob Wheeler
Price:       $2,995 (single copy)
Pages:      160

What's New in this Edition
Table of Contents

List of Figures
List of Tables

Ordering Information

  PDF (309 KB) This downloadable PDF from the 3rd edition contains the complete table of contents, list of figures, list of tables, preface and executive summary. It is representative of the depth and quality you will find in the new edition.

An In-Depth Look at High-Speed Interconnects

Interconnect technology, the nervous system for any computing, networking, and consumer device, transfers control messages and data within the system and ensures there are no choke points. Increasing bandwidth and the unique requirements of data centers, networking, computing, storage, and HDTV are driving a host of interconnect technologies. With these diverse requirements and competing stakeholders, interconnects are likely to be specialized for the target applications. At the same time, several of these interconnects will lose out or become niche solutions.

The report examines the leading high-speed interconnect technologies—including PCI Express, RapidIO, and HDMI—and provides an unbiased analysis of their strengths, future potential, and projected market position. In addition, within each interconnect, we examine the key vendors offering silicon products as well as the intellectual property to enable silicon. Within each interconnect we analyze market leaders and their products as well as identify technology leaders. We provide market forecast and share our picks for future winners in each interconnect segment.

The report covers transmitter, receiver, and switch products for HDMI, which has become the dominant interconnect on HDTVs. The report also covers products for DisplayPort, as well as bridge and switch products for PCI Express and RapidIO.

We look at the standards for these interconnects as well emerging standard such as USB 3.0 and 100Gbps Ethernet. Some of these changes will introduce a disconnect and could present opportunities for new leaders to emerge in the affected interconnects. These changes include DisplayPort, MR-IOV, PCI Express Gen2 and adoption of blade servers.

Evaluating and Comparing Competing Technologies

Like its predecessor, PCIe is moving beyond PCs into embedded and communications systems. Compared to PCI, PCIe offers greater scalability, robustness, and even broader applicability. RapidIO is championed by Freescale and Texas Instruments, which offer native RapidIO ports on their processor and DSPs, respectively. HyperTransport (HT), another alternative, is riding the success of AMD’s PC platform—creating opportunities for native HT peripherals. Each of these interconnects is backed by high-volume platforms—setting the stage for a positioning struggle. We evaluate each of these interconnects and project their relative acceptance.

Video is a driving application for consumer appliances, PCs, and networking. For video panels, HDMI has established a large installed base and can be found on most HDTV. The PC industry determined that its needs are best met with a new video/audio interconnect. Consequently, PC market leaders develop DisplayPort as the Interconnect between computer main-board and the monitor

We look at these competing options for video interconnects and project the evolution of this landscape. The report also examines the leading vendors and their products for each of these interconnects and provides an objective assessment of the vendors that are shipping production-qualified devices as well as projecting the future winners.

Get the Facts Quickly

"A Guide to High-Speed Interconnects" provides an in-depth look at the standards, products and vendors in this market. This new edition, packed with over 150 pages of valuable information, brings you up-to-date on the latest developments in this important market and gives you the analysis you need to help choose a supplier or partner in this field.

The report begins with tutorials on the key technologies implemented by these products, background on the networking market, and a discussion of the latest technology and market trends. Following these introductory chapters, the report delivers thorough coverage of all announced products in this area. For each of these vendors, the report examines the performance, feature set, and architecture of each product, highlighting its strengths and weaknesses in a consistent, easy-to-compare fashion. The report provides our own comparisons of these products and conclusions about which will fare best.

Make Informed Decisions

Senior analysts Jag Bolaria and Bob Wheeler draw on their broad experience in analyzing microprocessor technology to explain the microarchitecture and system interfaces of each device and how it will affect application performance. As the leading vendor of technology analysis for networking silicon, The Linley Group has the expertise to deliver the technical and strategic information you need to make informed business decisions.

Whether you are looking for the most effective solution for your application, a vendor to partner with, or a rising company to invest in, this report will cut your research time and save you money. Get the inside scoop on this market segment. Order “A Guide to High-Speed Interconnects ” today.

This report is written for:

• Engineers who are designing networking equipment and need to select a high-speed serial device.
• Marketing and engineering staff at companies that sell networking chips that incorporate or connect to high-speed serial devices.

• Technology professionals who wish an introduction to high-speed interconnect technology
.
• Financial analysts who desire a detailed analysis and comparison of serdes companies and their chances of success.
• Press and public relations professionals who need to get up to speed on this technology.

 

 


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