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Most Recent Guides & Forecasts

Communications Semiconductor Market Forecast 2018–2023
Provides five-year revenue forecasts for more than 20 categories of communications semiconductors, including Ethernet products, broadband interface chips, embedded processors, server processors and FPGAs.
Communications Semiconductor Market Share 2018
Provides market share data for more than 20 categories of communications semiconductors, including Ethernet products, broadband interface chips, embedded processors, server processors and FPGAs.
A Guide to Processors for Deep Learning
Covers processors and IP cores for accelerating deep learning, neural networks, and vision processing for AI training and inference in data centers, autonomous vehicles, and client devices.
A Guide to Multicore Processors
Covers 32- and 64-bit embedded processors with four or more CPU cores that are used for wires and wireless communications, storage, security, and other applications.
A Guide to Ethernet Switch and PHY Chips
Covers data-center switch chips for 10G, 25G, 40G, 50G, and 100G Ethernet. Also includes physical-layer (PHY) chips for 10GBase-T and 100G Ethernet.
A Guide to Processors for IoT and Wearables
Covers processors and connectivity chips for IoT clients and wearable devices, focusing primarily on single-chip solutions with integrated radios.

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White Papers

Accelerating AI Performance in an Open Software Ecosystem
Nvidia's software stack, based on its proprietary CUDA, creates a high barrier to entry for challengers. SYCL, the only open alternative to CUDA that has multivendor support, enables customers to move to higher performance hardware while retaining software flexibility. A commercial version of SYCL, branded ComputeCpp, is offered by Codeplay.
Arm Ecosystem Reduces SoC Design Cost and Time to Market
This paper discusses three critical facets of the Arm ecosystem: design verification, physical design, and software development. Each one directly affects the time required to develop a complete SoC and software stack.
AI Requires Many Approaches
Artificial intelligence (AI) is being applied to a wide range of problems, so no single processor can support them all. This paper describes and compares the various approaches needed for data center, autonomous driving, and consumer/IoT applications. 
Universal RDMA: A Unique Approach for Heterogeneous Data-Center Acceleration
Now available in 10G, 25G, 50G, and 100G Ethernet server adapters, RDMA reduces network processing overhead and minimizes latency. Cavium's FastLinQ stands out by handling both RoCE and iWARP, which are alternative protocols for RDMA over Ethernet.
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October 14, 2019

Everspin Raises MRAM Density
The leader in discrete MRAM is shipping a 1Gb device, narrowing the density gap to DRAM. GlobalFoundries offers the Everspin technology for embedded MRAM.
Editorial: The Many Faces of 5G
5G is off to a flying start, but depending on the band support and price, different 5G devices offer higher or lower data rates and may be missing other important benefits of the new protocol.
Arm Joins Bfloat Parade
To accelerate neural-network training, Arm will support the Bfloat16 data format, which doubles throughput for the matrix-multiplication operations at the heart of most AI models.

October 7, 2019

Huawei Delivers Powerful AI Training
The company’s new Ascend 910 takes its DaVinci architecture into the top performance tier in AI training. Huawei will deliver accelerator cards, servers, and clusters incorporating the chip.
Exynos 980 Integrates 5G Modem
The Exynos 980 5G is Samsung’s first smartphone processor to integrate a 5G modem. The first processor to use Arm’s Cortex-A77, it also features Samsung’s fastest deep-learning accelerator.
Ceva and Synopsys Spin More TOPS
To support neural-network inference in autonomous vehicles and other high-performance edge devices, new multicore deep-learning accelerators can generate 100 TOPS or more.

September 30, 2019

Kirin 990 First to Integrate 5G
Huawei is the first company to fully announce a processor with an integrated 5G modem. The new flagship processor also leads in smartphone AI performance.
Prepare for Copackaged Optics
Electrical-I/O pin bandwidths are almost out of runway, and chips will soon hit the serdes wall. Copackaged optics provide a path forward by reducing reach, but they present a new set of challenges.
Editorial: Intel 10nm Disappoints
Intel recently began 10nm production, but the new technology falls short of its speed and power goals. These shortcomings affect the company’s current and future 10nm PC and server products.

September 23, 2019

Tsinghua Pedals Hybrid AI Processor
Tianjic’s novel hybrid architecture can concurrently run convolutional neural networks, multilayer perceptrons, recurrent neural networks, and other deep neural networks, as well as biologically inspired continuous-attractor and spiking neural networks.
Power9 AIO Boosts DRAM Bandwidth
IBM’s new Power9 AIO (Advanced I/O) server processor introduces the Open Memory Interface (OMI)—a superfast alternative to DDR4. Special DIMMs boost the peak bandwidth to 410GB/s, making Power9 ideal for memory-intensive applications.

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Fall Processor Conference 2019 - Register Now

Events

Linley Fall Processor Conference 2019
October 23 - 24, 2019
Hyatt Regency, Santa Clara, CA
Register Now!
Linley Spring Processor Conference 2019
Held April 10 - 11, 2019
Proceedings available
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Media Appearances

Newsletter

Linley Newsletter
Analysis of new developments in microprocessors and other semiconductor products
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