Mobile Conference 2013
Proceedings Available
Held on April 17 - 18, 2013

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Agenda for Day Two: April 18, 2013
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9:00am-9:30amSpecial Presentation

Embedded Vision: Giving Mobile Devices the Ability to “See and Understand”
Jeff Bier, Founder, Embedded Vision Alliance

With their powerful image sensors and processors, today's mobile devices are capable of sophisticated computer vision functionality.  Semiconductor suppliers, OEMs and software vendors are investing to enable mobile visual intelligence for tasks such as computational photography, gesture UIs and augmented reality.  Embedded vision presents meaningful differentiation opportunities for OEMs, chip suppliers and others -- but it's a challenging technology to get right.  This presentation explores the trends around vision capabilities in mobile devices and discuss the challenges associated with implementing robust vision functionality.

9:30am-12:00pmSession 4: Mobile DSP

This session, moderated by Scott Gardner, senior analyst at The Linley Group, will focus on DSPs and specialized CPUs that offload processing in mobile SoC designs.

DSP Programming Made Easy
Moshe Sheier, Director, Audio/Voice Product Management, CEVA

CEVA will announce new technology for mobile DSPs, addressing the growing requirements for specialized processing in applications that range from computer vision, through audio and voice processing, and to wireless communications. To address this diverse range of mobile DSP applications, modern DSP architectures must meet the most power-stringent requirements while also allowing efficient software development in embedded environments. In this session, CEVA will reveal new details about its new software technology for a broad range of DSP applications.

Modem Processors with Modem Processing Language (MPL) will Prevail over DSP Processors
Gilad Garon, CEO, ASOCS

The fierce competition in the wireless industry is demanding shorter development cycles. Furthermore, the dramatic shift in the engineering-skills set from firmware to high-level software is driving the industry to seek new development approaches to reduce the time it takes to bring a new wireless, physical-layer design to market. This talk introduces a new framework for programming using C+, coupled with a dynamic hardware-based function call solution (Modem Processing Unit - MPU) that is poised to become the natural way to build new communications SOC's.

Break - Sponsored by Imagination

A New Imaging and Vision Architecture: Solving Grand Challenge Problems in Milliwatts

As the range of "killer platforms" expands – smartphones, tablets, TVs, cars – the focal "killer apps" are increasingly driven by sophisticated imaging and vision functions.  The needs are daunting – performance must scale above a trillion pixel operations per second, sustained power budgets must remain in tens to hundreds of milliwatts, and ease of programming must rival that of generic CPU apps development.  This talk describes the technical demands of key imaging, video and vision applications at the heart of next generation platforms, and introduces the Tensilica IVP architecture, built specifically for low-energy computation of advanced multi-frame image enhancement and object recognition at HD and UHD video rates.

Shorter Mobile Design Cycles Require a Platform Approach
Mahadev Kolluru, Director of Technical Solutions, VeriSilicon

The key challenge facing SoC designers is to reduce design costs and shrink design cycles, while delivering effective solutions for Mobile systems. VeriSilicon, a Custom Silicon Solutions Provider, offers a wide range of licensable IP, turnkey chip design and manufacturing services that deliver a faster time-to-market advantage to customers, through their Platform solutions approach. This talk will describe the unique challenges in supporting the tremendous amount of on-going feature integration within mobile systems in China and other fast-growing regions

There will be Q&A and a panel discussion featuring above speakers.

12:00pm-1:15pmLunch Sponsored by Imagination

Keynote Panel: Challenges and Opportunities for Mobile Markets in China
J. Scott Gardner, The Linley Group

This panel, moderated by J. Scott Gardner, senior analyst at The Linley Group, will feature senior executives from a broad spectrum of the mobile industry addressing the challenges and opportunities for mobile products in China and other fast-growing regions. The panelists are experts from leading companies delivering semiconductors, intellectual property, and cellular connectivity for these markets. Each executive will offer a short commentary on the key issues facing the industry, followed by an interactive panel discussion that addresses questions from the moderator and the conference attendees.

The panelists include:

Diana Jovin - Vice President of Strategy and Investor Relations - Spreadtrum

Before joining the company in June 2011, Ms. Jovin was VP of Corporate Marketing and Business Development for mobile TV provider Telegent Systems. In this role, she developed relationships with local handset brands, operators, value-added service providers and advertising partners in emerging markets, and was responsible for the company's communications program. Before Telegent, Ms. Jovin built two software companies from concept through acquisition, including CascadeWorks, where she was co-founder and CEO, and NetDynamics, where she was Director of Marketing and which was acquired by Sun Microsystems in 1998. Ms. Jovin holds an MBA from the Haas School of Business and a BA from Harvard University.

Amit Rohatgi - Vice President, Segment Marketing - Imagination Technologies

Amit Rohatgi joined Imagination in 2013 when the company acquired MIPS Technologies, Inc., a leading provider of CPU IP. At MIPS, Mr. Rohatgi was Vice President of Mobile Solutions, and was instrumental in the company's partnership with Google that led to the adoption of the MIPS architecture in Android. Prior to joining MIPS in 2011, Amit spent 12 years as Senior Staff Engineer/Manager at Qualcomm Inc., a world leader in 3G and next-generation mobile technologies. Mr. Rohatgi has deep engineering expertise spanning a diverse background in multimedia and physical layer embedded systems, modem design, mobile chip architecture, DSP firmware and security architectures. Mr. Rohatgi holds a B.S. and an M.S. in Electrical Engineering from Purdue University.

Johan Lodenius - Corporate Vice President and the Chief Marketing Officer - MediaTek

In this role Johan leads a corporate marketing organization responsible for global marketing and business development. A seasoned industry veteran, Lodenius started his career in 1988 as a chip design engineer at Ericsson and was the original Senior Vice President of Marketing and Product Management for Qualcomm's QCT division. During Johan's tenure from 1996-2004 Qualcomm grew its chipset business from a small internal ASIC team to become the world's leading wireless semiconductor supplier. Since then Johan founded and managed several new technology companies including Coresonic, a DSP core company that was acquired by MediaTek earlier this year.

Daniel Zhao - Director of Terminal and Application - China Mobile USA Research Center

As the Director of Terminal and Application, Daniel Zhao is driving the innovation of mobile application and service platforms as well as leading the terminal sub-system research at China Mobile USA Research Center. Prior to China Mobile, Daniel was the director of field operations at ArcSoft, where he took variety of technical and management roles for both its internet services division and mobile business unit. Daniel received his Bachelor's degree of Computer Science from University of Science and Technology of China (USTC), and Master degree from Polytechnic University (now Polytechnic Institute of NYU) and Institute of Software of Chinese Academy of Sciences.

There will be Q&A and a panel discussion featuring the keynote speakers.

Break - Sponsored by Imagination

2:35pm-4:45pmSession 5: Power-Optimized Design

This session, moderated by Kevin Krewell, senior analyst at The Linley Group, explores how designers balance delivering increased system performance within the power constraints of mobile devices

Cool Running: Avoiding Thermal Shutdown While Still Delivering Peak Performance
Peter McGuinness, Director of Multimedia Marketing, Imagination

Power consumption in mobile SoC design has traditionally been viewed as a battery life issue but with smartphone apps pushing boundaries on every axis, staying within a reasonable thermal envelope while performing to specification is today's critical issue. This presentation explores architectural techniques for power and thermal envelope management in mobile devices. . Real world examples will be drawn from designs using Imagination Technologies' hardware IP and novel approaches will be presented including PowerGearing in PowerVR GPUS where dynamic activation of processing clusters is used to optimize the power/performance curve.

Meeting Power, Performance and Reusability Requirements for Mobile System Designs
Hezi Saar, Staff Product Marketing Manager, Synopsys

SoC designs targeting mobile systems are challenging and require interface re-use across many applications. For example, the variety of low power chip-to-chip interfaces available makes selecting the right chip-to-chip interface a difficult task. This presentation will cover the options available in interfaces for SoCs targeting mobile applications. It will go into detail on the benefits of new features like High Speed Gear3 and Low Power Modes.

Power is The Hidden Cost of Flexibility
Timothy Saxe, CTO, QuickLogic

While there is no doubt that the software running on processors creates tremendous application value, there is a power cost to be paid.  Normally the trade-off is worth a slightly larger battery for a prized new feature.  But when energy has very strict limits, for example, in wearable devices, the flexibility of a processor may not be worth the power.  Taking sensor data acquisition, for example, QuickLogic will show how a hardware solution can reduce power consumption by a factor of 10.

Building the Next Generation of IA Mobile and Communication Devices
Bruce Fleming, Sr. Principal Engineer, Intel

Today's consumers are embracing sleek touch devices that are always connected for consuming immersive content, browsing the web and taking photos. Intel has a product roadmap and the technology leadership to build optimized IA (x86) platforms that balance performance and power for next generation Windows and Android tablets as well as Android smartphones. In this session, the company will show how it debunks the x86 power myth and can deliver a balanced product, while enabling a great performance-driven user experience.

There will be Q&A and a panel discussion featuring above speakers.

4:45pmEnd of Conference


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