Linley Mobile & Wearables Conference 2016
Focusing on IC and system design for mobile and wearable devices
Held on July 26 - 27, 2016
Hyatt Regency, Santa Clara, CA

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Agenda for Day Two: Wednesday July 27, 2016
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9:00am-9:55amKeynote

State of the Art in Smartphones and Wearables
Jim Morrison, VP Competitive Technical Intelligence, Chipworks, TechInsights

This presentation will highlight some of the major IC's and manufacturers winning sockets in today's highest volume smartphones and wearables released over the last several months. Every year, Chipworks purchases and analyzes more than 500 high-volume consumer electronics products from around the world. Data and imagery presented will show IC's that are wining dozens of sockets in multiple consumer products for applications ranging from inertial sensors and wireless IC's for wearables to laser range finders used in the latest smartphones from Samsung, Huawei, Asus and others.

9:55am-10:15amSession 4: Mobile SoC Design

Today's mobile SoCs combine a wide range of technologies into a single chip. Processor cores of all types must be efficient and optimized for mobile tasks. Many designs use a network-on-a-chip (NoC) to tie everything together. This session, moderated by Linley Group senior analyst Loyd Case, covers several important technologies for mobile SoC design.

Multi-Purpose, Low-Power DSPs for Mobile and Other Markets
David Heine, Senior Design Engineering Architect, Cadence

Power-sensitive mobile and automotive applications require efficient signal processing for tasks ranging from communications and radar to multimedia and sensor processing. They require an energy-efficient DSP supporting computationally intensive workloads and multiple data types and precisions. In this presentation, Cadence will announce a new Tensilica DSP, built on proven Xtensa technology, that meets these needs. As with any Tensilica processor, it's easy to program with its included 32-bit processor for real-time control, comprehensive software-development tools, and an optimized DSP software library.

10:15am-10:40amBREAK - Sponsored by Qualcomm
10:40am-11:50amSession 4: Mobile SoC Design (cont)

An Efficient QoS-Aware Coherent Architecture for Mobile SoCs
Joe Rowlands, Chief Architect, NetSpeed Systems

With heterogeneous system architectures becoming the norm in many mobile and automotive designs, SoC architects must create efficient cache-coherent systems with IP sourced from multiple vendors. To improve power, performance, and area, these IP blocks share memory, cache space, and interconnect resources. But if the shared resources are not well managed, severe resource contention can occur, resulting in unpredictable application performance. This presentation examines how architects can effectively address these challenges using NetSpeed's cache coherent NoC IP, Gemini and last level cache IP, Pegasus.

Heterogeneous Cache Coherency using Highly Configurable and Scalable Interconnect IP
JP Loison, Corporate Application Engineer, Arteris IP

Hardware cache coherency has become common, but it has suffered from scalability and physical-design issues while adapting poorly to the requirements of dissimilar caching agents. This presentation describes a new technology optimized for heterogeneous cache coherency; it can interconnect processing agents that have differing coherence models, cache organizations, transaction table sizes, and workloads. This technology enables non-coherent IP cores to participate as coherent peers and can handle multiple configurable snoop filters, proxy caches, and a distributed modular hardware architecture.

There will be Q&A and a panel discussion featuring above speakers.

11:50am-1:00pmLUNCH
1:00pm-2:40pmSession 5: Processors for Wearables

Wearables are the fastest growing and fastest changing mobile segment. Whereas initial devices were cobbled together using off-the-shelf parts, new processors specifically address the needs of this market. This session, moderated by Linley Group principal analyst Linley Gwennap, will discuss the segments of the wearables market and the differing requirements of each. It will also cover some of the newest processors for wearable devices.

Smart Wearables: Unleashing The Next Era of Wearables Innovation
Pankaj Kedia, Sr. Director, Product Management, Qualcomm

The wearables segment is growing rapidly, device segmentation is evolving, the ecosystem is expanding, and consumers have the luxury of choosing from a variety of products. Device makers are advancing in smaller and sleeker form factors, longer battery life, smarter sensing, and always-connected experiences. In this presentation, Qualcomm will lay out its vision for the wearables segment and explain how the company offers a solid foundation upon which its customers and partners can innovate to enable these advances.

The Right Processor for Wearable Devices
Cliff Lin, Senior Director, MediaTek

While some chip makers try to cram overpowered smartphone chips into wearables, this approach does not address the needs of this broad market. Simple applications require minimal processing but low cost. Devices that run a high-level operating system, such as Android Wear smartwatches, need more CPU and GPU performance but must still minimize power. This presentation will discuss the processor requirements of the different wearables segments and show how MediaTek's broad lineup of highly integrated processors optimally addresses them.

Designing the Next Generation of Wearables
Scott Runner, VP, IoT & Automotive, Semiconductor & Embedded Systems, Aricent

Miniaturization, energy optimization and increased integration will open the door to new applications not yet conceived. This presentation will address three major challenges for next-generation wearables: human-centered engineering, communications design and cost optimization. The human experience and approach must change to enable new experiences. Untethered devices offer new approaches to partitioning where compute, analytics and even aspects of human interfaces are performed. Optimizing costs while concurrently addressing these other challenges is perhaps the most difficult aspect of system design.

There will be Q&A and a panel discussion featuring above speakers and guest panelist: Ali Tahmaseb, Founder and CEO,  BLOCKS

2:40pm-3:00pmBREAK - Sponsored by Qualcomm
3:00pm-4:10pmSession 6: Faster, Smarter Sensors

Mobile devices rely on a wealth of sensors to better understand the outside world. Cameras, microphones, accelerometers, and pressure sensors are just a few of the dozens of sensors found in a high-end smartphone. Wearables have fewer sensors, but they play a big role in popular fitness and health applications. This session, moderated by Linley Group senior analyst Mike Demler, will discuss new methods of collecting and analyzing sensor data and how these methods will improve mobile system design.

MIPI Camera, Display, and Sensor Interfaces for Multimedia Applications
Hezi Saar, Staff Product Marketing Manager, Synopsys

Cameras and displays have become prevalent in drones, virtual reality, and advanced driver assistance systems (ADAS), forcing SoC designers to seek a solution that will interconnect image sensors, displays, and other sensors in their designs. This presentation will address:
- Key advantages and use cases of MIPI camera (CSI-2) and display (DSI) interfaces
- The role of compliant IP solutions in a CSI-2 and DSI implementation
- The MIPI I3C specification for sensor connectivity

Enabling a Multi-Sensory World
Peter Hartwell, Senior Director of Advanced Technology, InvenSense

The first generations of IoT devices employed discrete sensors, along with micro-controller based sensor hubs that performed sensor fusion with limited multi-purpose capabilities. Recent innovations in MEMS technology has enabled a new generation of application specific smart sensors that combine multiple sensors, CMOS processors, and memory. This presentation explores these technology advances and the role of software and algorithms, which in combination with cloud services will produce compelling new form factors and capabilities in a myriad of consumer and IoT markets.

There will be Q&A and a panel discussion featuring above speakers.

4:10pmEND OF CONFERENCE

 

Platinum Sponsor

Gold Sponsor

NetSpeed Systems

Industry Sponsor

EEMBC