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Die Photos Show Cortex-A78 Shortfall
Arm’s new CPUs were supposed to bring new efficiencies to smartphone processors, but initial implementations of Cortex-X1 and Cortex-A78 are larger than expected, reducing area efficiency.
Cadence Floats K-Series DSPs
The new Tensilica KP1, KP6, KQ7, and KQ8 DSPs are optimized for floating-point workloads, offering up to a 40% area reduction and 30% energy savings relative to previous Tensilica DSPs.
Qualcomm Targets 5G Embedded
The four new embedded products target industrial tablets, drones, point-of-sale terminals, kiosks, and similar applications, particularly those that can take advantage of its integrated 5G modem.
Training Competitors Battle on MLPerf
The latest benchmark scores for AI training show that three challengers—Graphcore’s GC200, Habana’s Gaudi, and Huawei’s Ascend—are making progress but still lag Nvidia’s A100 and Google’s TPUv4.
Marvell Adds Vectors to Octeon 10
The company’s newest data-processing unit (DPU) adds vector packet processing and an AI engine. Marvell expects to sample the first Octeon 10 processors later this year, targeting edge and cloud networking.
NXP S32R Handles Automotive Radar
The new chips address the entire range of automotive-radar applications from ADAS to self-driving cars. They include the S32R294 microcontroller, S32R45 imaging-radar processor, and TEF82xx transceivers.
ProteanTecs Aids in Manufacturing
Startup ProteanTecs licenses its Universal Chip Telemetry platform, which combines AI models and a collection of sensors, to reduce chip defect rates by 10x and to cut manufacturing costs.
Data Centers Drive to 800Gbps Optics
At the recent Optical Fiber Communication Conference (OFC), Broadcom, Marvell, and MaxLinear announced 112Gbps PAM4 physical-layer chips, including the first built in 5nm technology.
Quadric’s Flexible Edge Accelerator
Startup Quadric is now sampling its first chip, a data-flow processor that can handle a range of tasks from signal processing to AI. The 256-core design consumes less than 4W and targets edge applications.
P550 Doubles Floating-Point Capability
After picking up new customers Renesas and Tenstorrent, SiFive released two new CPU cores: the P270 and P550. These offerings sit atop the product stack, targeting Linux-based application processors.
CertusPro-NX Delivers 10G Serdes
Continuing to extend its Nexus family, Lattice is again taking advantage of fully depleted silicon-on-insulator (FD-SOI) technology to challenge Intel and Xilinx in low-density FPGAs.
FinFET Roadmap Ends at 3nm
The FinFET has enjoyed a good 10-year run, but the next process node will likely be its last. At 3nm, TSMC will stick with FinFETs, but Samsung plans to switch to next-generation nanosheet transistors.
New AI Engines Give Versal an Edge
Xilinx introduced the AI Edge line for automotive and industrial applications. An updated AI Engine doubles compute capacity relative to the previous generation.
Intel Fills Out 11th-Gen Laptop Lineup
Intel’s 10nm process is displacing 14nm across the Core laptop lineup. Tiger Lake-H replaces Comet Lake-H for mobile gamers, whereas new Tiger Lake-UP3 versions update the thin-and-light segment.
Radeon 6800M Tackles GeForce 3080
AMD updated its laptop GPUs to the RDNA2 architecture, boosting gaming performance by 50% over the previous generation and matching up against Nvidia’s RTX 3080 for Laptops.
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