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Most Recent | Archive: 2021   |   2020   |   2019

  July 27, 2021   Die Photos Show Cortex-A78 Shortfall
Arm’s new CPUs were supposed to bring new efficiencies to smartphone processors, but initial implementations of Cortex-X1 and Cortex-A78 are larger than expected, reducing area efficiency.
  July 20, 2021   Cadence Floats K-Series DSPs
The new Tensilica KP1, KP6, KQ7, and KQ8 DSPs are optimized for floating-point workloads, offering up to a 40% area reduction and 30% energy savings relative to previous Tensilica DSPs.
  July 20, 2021   Qualcomm Targets 5G Embedded
The four new embedded products target industrial tablets, drones, point-of-sale terminals, kiosks, and similar applications, particularly those that can take advantage of its integrated 5G modem.
  July 20, 2021   Training Competitors Battle on MLPerf
The latest benchmark scores for AI training show that three challengers—Graphcore’s GC200, Habana’s Gaudi, and Huawei’s Ascend—are making progress but still lag Nvidia’s A100 and Google’s TPUv4.
  July 13, 2021   Marvell Adds Vectors to Octeon 10
The company’s newest data-processing unit (DPU) adds vector packet processing and an AI engine. Marvell expects to sample the first Octeon 10 processors later this year, targeting edge and cloud networking.
  July 13, 2021   NXP S32R Handles Automotive Radar
The new chips address the entire range of automotive-radar applications from ADAS to self-driving cars. They include the S32R294 microcontroller, S32R45 imaging-radar processor, and TEF82xx transceivers.
  July 13, 2021   ProteanTecs Aids in Manufacturing
Startup ProteanTecs licenses its Universal Chip Telemetry platform, which combines AI models and a collection of sensors, to reduce chip defect rates by 10x and to cut manufacturing costs.
  July 6, 2021   Data Centers Drive to 800Gbps Optics
At the recent Optical Fiber Communication Conference (OFC), Broadcom, Marvell, and MaxLinear announced 112Gbps PAM4 physical-layer chips, including the first built in 5nm technology.
  July 6, 2021   Quadric’s Flexible Edge Accelerator
Startup Quadric is now sampling its first chip, a data-flow processor that can handle a range of tasks from signal processing to AI. The 256-core design consumes less than 4W and targets edge applications.
  July 5, 2021   P550 Doubles Floating-Point Capability
After picking up new customers Renesas and Tenstorrent, SiFive released two new CPU cores: the P270 and P550. These offerings sit atop the product stack, targeting Linux-based application processors.
  June 29, 2021   CertusPro-NX Delivers 10G Serdes
Continuing to extend its Nexus family, Lattice is again taking advantage of fully depleted silicon-on-insulator (FD-SOI) technology to challenge Intel and Xilinx in low-density FPGAs.
  June 29, 2021   FinFET Roadmap Ends at 3nm
The FinFET has enjoyed a good 10-year run, but the next process node will likely be its last. At 3nm, TSMC will stick with FinFETs, but Samsung plans to switch to next-generation nanosheet transistors.
  June 29, 2021   New AI Engines Give Versal an Edge
Xilinx introduced the AI Edge line for automotive and industrial applications. An updated AI Engine doubles compute capacity relative to the previous generation.
  June 22, 2021   Intel Fills Out 11th-Gen Laptop Lineup
Intel’s 10nm process is displacing 14nm across the Core laptop lineup. Tiger Lake-H replaces Comet Lake-H for mobile gamers, whereas new Tiger Lake-UP3 versions update the thin-and-light segment.
  June 22, 2021   Radeon 6800M Tackles GeForce 3080
AMD updated its laptop GPUs to the RDNA2 architecture, boosting gaming performance by 50% over the previous generation and matching up against Nvidia’s RTX 3080 for Laptops.
  June 22, 2021   Upmem Nails RowHammer
French startup Upmem has patented a new defense against RowHammer attacks that corrupt memory. Dubbed Silver Bullet, it’s available to DRAM manufacturers as licensable intellectual property.
  June 15, 2021   Efinix Fills Out 16nm FPGA Roadmap
Three years after sampling its first chip, Efinix is sampling second-generation Trion Titanium FPGAs manufactured in TSMC 16nm. The latest family members offer greater density and new features.
  June 15, 2021   Marvell PHYs Drive Multigigabit Cars
Marvell’s new 88Q4364 Ethernet PHY complies with the 802.3ch automotive Ethernet standard, which the IEEE ratified last year. It delivers 2.5Gbps, 5Gbps, or 10Gbps on shielded single-pair wiring.
  June 8, 2021   Agilex Moves to SuperFin
Intel’s initial 10nm FPGAs are now slated to reach general availability in Q3 after a delay owing to a redesign to the 10nm SuperFin process, which offers a dramatic reduction in power.
  June 8, 2021   Arm Extends Valhall to Low-End GPUs
Arm’s third-generation Valhall GPUs boosts performance across all Mali product tiers. The Mali-G310 is the company’s first new entry-level design in three years, succeeding the Bifrost-based Mali-G31.
  June 8, 2021   MLPerf 1.0 Adds Power Measurements
Nvidia dominated the latest round of MLPerf Inference submissions, but Qualcomm’s Cloud AI delivered leading performance per watt on two of the six neural networks. Many other vendors were absent.
  June 1, 2021   Arm NI-700 Puts a NoC in CoreLink
To support its new Arm v9 CPUs, the company has developed a new dynamic shared unit and two new CoreLink interconnect products, the CI-700 cache-coherent interconnect and the NI-700 network-on-a-chip.
  June 1, 2021   Arm v9 Yields Three New CPUs
In a company first, Arm released three CPUs at once, prompted by its transition to Arm v9. They include Cortex-X2, Cortex-A710, and Cortex-A510, the company’s first new “little” core in four years.
  June 1, 2021   Dimensity 900 Jumps to Cortex-A78
MediaTek has refreshed its Dimensity 800 family with the latest CPU and GPU cores as well as new standards such as Wi-Fi 6 and LPDDR5 to enhance performance in midrange 5G smartphones.
  May 25, 2021   IBM Test Chip Is First at 2nm
IBM has manufactured the industry’s first test chip in 2nm technology. Compared with 7nm FinFETs, the gate-all-around (GAA) transistors allow 3.4x the density with 45% greater speed or 75% less power.
  May 25, 2021   Lattice Sets Midrange FPGA Collision
Known for tiny low-power FPGAs, Lattice is developing a new family called Avant that will target the midrange segment. It expects to introduce the first Avant devices late next year.
  May 25, 2021   Unisoc T760 Launches Tanggula
Under its mountainous moniker Tanggula, Chinese vendor Unisoc plans to deliver four new 5G –chip families to revitalize its smartphone lineup. The first new product is a midrange chip called the T760.
  May 18, 2021   Allwinner Creates First RISC-V AP
Using a CPU licensed from Alibaba, Allwinner’s D1 is the industry’s first RISC-V application processor. Featuring a GPU, DSP, and audio/video codec, it is available in a $13 development board.
  May 18, 2021   Nvidia Orin Turbocharges ADAS
Nvidia’s Orin chip delivers a big performance and power-efficiency boost compared with previous Drive Xavier systems. But the next-generation Atlan will raise the bar even higher—to 1,000 TOPS.
  May 11, 2021   Cadence Q8 Expands Vision DSPs
Cadence’s new Tensilica Vision DSPs extend its intellectual-property (IP) lineup at the high end to target 3D computer vision and at the low end to reduce area and power in always-on smart sensors.
  May 11, 2021   SiFive 21G1 Update Boosts Hash Rates
The intellectual-property (IP) company announced a new AI platform that uses the Intelligence extensions to reduce convolution-processing time by 4x compared with a standard RISC-V vector implementation.
  May 4, 2021   Movellus Improves Clock Meshes
The startup’s Maestro intellectual property (IP) enhances clocking efficiency by up to 30%, boosting chip performance and saving power. The “virtual mesh” also accelerates timing closure by 5x.
  May 4, 2021   Neoverse V1 Updates Cortex-X1
Arm’s new Neoverse V1 and Neoverse N2 cores boost performance and add new instructions relative to the older Neoverse N1, but they still fall short of the leading x86 CPUs in single-thread performance.
  May 4, 2021   Nvidia Arms Its Data-Center Roadmap
Nvidia aims to accelerate Arm-CPU adoption for cloud computing with the upcoming Grace processor as well as next-generation GPU and networking (DPU) products. The company also rolled out A10 and A30 GPUs for AI.

Most Recent | Archive: 2021   |   2020   |   2019


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